Description
Electrostatic Force Range:50N to 200N
Vacuum Level:≤10^-6 Torr
Wafer Size Compatibility:100mm to 300mm
Temperature Range:-40°C to 200°C
Material:Stainless Steel & Aluminum
Operating Voltage:DC 12V
Current Consumption:≤1.5A
Power Supply Compatibility:AC/DC
The LAM electrostatic chuck model 839-800327-315 is engineered to withstand the rigors of high-volume plasma etching and deposition processes, ensuring consistent and reliable results in semiconductor fabrication.
Crafted from premium grade stainless steel, our chuck offers superior corrosion resistance and durability, critical for maintaining precision in long-term industrial use.
With adjustable electrostatic force ranging from 10N to 100N, users can precisely control the bonding strength between the wafer and the chuck surface, optimizing the processing efficiency and reducing wafer damage.
Capable of operating under vacuum conditions down to 1×10^-5 Torr, this electrostatic chuck ensures optimal plasma processing environments for achieving high-quality surface modifications on semiconductor wafers.
Equipped with a standard RS-232 interface, it seamlessly integrates with various control systems, facilitating easy setup and operation, and enhancing compatibility with existing manufacturing lines.
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